High modulus silicones as toughening agents for epoxy resins
US5262507A · kind A · utility
9Cited by
1References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 1991 |
| Grant date | Nov 16, 1993 |
| Priority date | — |
| Expiry date | Dec 20, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0353
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to certain new high modulus silicones, toughened epoxy thermoset resin systems made from those silicones, and composites that are prepared from the new toughened epoxy resin systems. The silicone resins are specifically monophenyl-containing polysiloxanes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.