Chip carrier for an integrated circuit assembly
US5262674A · kind A · utility
9Cited by
5References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 9, 1992 |
| Grant date | Nov 16, 1993 |
| Priority date | — |
| Expiry date | Apr 9, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Epoxy bonding between an IC chip and a chip carrier is strengthened by creating substantially rougher oxidized surfaces within substantially smooth gold surfaces of a die paddle portion of the chip carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.