Contact-making system for semiconductor wire connections
US5263631A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 16, 1993 |
| Grant date | Nov 23, 1993 |
| Priority date | — |
| Expiry date | Mar 16, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A contact-making system for wire connections on electronic components in semiconductor connection technology, which includes a contact-making device having a capillary tube arranged thereon for guiding a bonding wire, and at least one electrode, which is allocated to the head piece of the capillary tube, for producing a spark transfer, by which spark transfer a bonding-wire endpiece which projects from the head piece is melted to form a bonding-wire sphere, the bonding-wire sphere being uniformly shaped and arranged concentrically with respect to the bonding wire or with respect to the bonding-wire endpiece by providing at least two or more electrodes which are distributed uniformly on the circumference with respect to the head piece or to the bonding-wire endpiece and are in each case effectively connected to an independent power unit, which is constructed as a current source, it being possible to activate the power units from a single control unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.