Apparatus for positioning integrated circuit packages for tinning
US5263632A · kind A · utility
11Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 6, 1992 |
| Grant date | Nov 23, 1993 |
| Priority date | — |
| Expiry date | Aug 6, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S269/903
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A fixture for positioning high density packaged integrated circuits for tinning which includes a clamp bar assembly pivotally attached to a base. The base includes recessed nests in which the high density packages are positioned. The high density packages are secured in the nests by the clamp bar assembly. The top surfaces of the high density packages are protected from the solder wave by the base. A predetermined spacing and orientation of the nests ensures proper tinning.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.