Method for heating biocompatible implants in a thermal packaging line
US5263991A · kind A · utility
35Cited by
43References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 1992 |
| Grant date | Nov 23, 1993 |
| Priority date | — |
| Expiry date | Oct 21, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S623/901
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A thermal packaging unit for a biocompatible implant. The thermal packaging unit includes a first compartment for storing the biocompatible implant. In addition, the thermal packaging unit further includes a second compartment which is operable to contain a chemical composition which is able to heat the biocompatible implant by means of an exothermic reaction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.