Method of forming a three-dimensional printed circuit assembly
US5264061A · kind A · utility
210Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 22, 1992 |
| Grant date | Nov 23, 1993 |
| Priority date | — |
| Expiry date | Oct 22, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1043
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A three-dimensional printed circuit assembly is formed by first making a substrate (20). A substrate (20) is first formed from a photoactive polymer (14) that is capable of altering its physical state when exposed to a radiant beam (30). At this point, the substrate is only partially cured. A conductive circuit pattern (50) is then formed on the partially cured substrate. The substrate is then molded to create a three-dimensional structure, and then further cured to cause the photoactive polymer to harden.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.