Patent · US Expired

Radiation-polymerizable mixture and process for producing a solder resist mask

US5264324A · kind A · utility

3Cited by

11References

18Claims

0Family size

Assignee

Hoechst GmbH · DE

Inventors

Michael Emmelius · Mainz, DE
Walter Herwig · Bad Soden, DE
Kurt Erbes · Frankenthal (Pfalz), DE
Rudolf Decker · Bodenheim, DE

Key dates

Filing date	Sep 20, 1990
Grant date	Nov 23, 1993
Priority date	—
Expiry date	Sep 20, 2010

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S430/136
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The present invention relates to a radiation-polymerizable mixture which includes a polymerizable compound, a polymeric binder which has units of methacrylic acid, a methacrylic acid ester and a styrene, the latter in a proportion of 40 to 65% by weight, a finely divided mineral pigment on a silicic acid or silicate basis, a photopolymerization initiator, a compound having at least two epoxy groups in its molecule and a thermal hardener for epoxy groups. The mixture is advantageous, in particular, for producing solder masks and can be cured after exposure to an image and development by heating to about 80.degree. to 150.degree. C. to form a stencil which is resistant under soldering conditions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.