Organopolysiloxane composition for the formation of a cured release film
US5264499A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 1992 |
| Grant date | Nov 23, 1993 |
| Priority date | — |
| Expiry date | Dec 17, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The instant invention pertains to an organopolysiloxane composition for the formation of a release film, that has a high curing rate at relatively low temperatures (.ltoreq.100.degree. C.) and that forms a cured film that both adheres strongly to various types of substrates and is highly releasing for tacky or sticky substances. The organopolysiloxane composition for the formation of a cured release film of the instant invention comprises (A) organopolysiloxane that contains in each molecule at least 2 alkenyl groups with the general formula H.sub.2 C.dbd.CH--(CH.sub.2).sub.n --, wherein n=2 to 8; (B) an organohydrogenpolysiloxane that contains in each molecule at least 2 silicon-bonded hydrogen atoms and at least 1 alkenyl group with the general formula H.sub.2 C.dbd.CH--(CH.sub.2).sub.n --, wherein n=2 to 8; (C) an addition-reaction inhibitor; (D) platinum group metal catalyst; and optionally (E) a nonreactive organopolysiloxane that contains neither silicon-bonded alkenyl nor silicon-bonded hydrogen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.