Programmable chip to circuit board connection
US5264664A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 1992 |
| Grant date | Nov 23, 1993 |
| Priority date | — |
| Expiry date | Apr 20, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/173
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A carrier module such as a chip carrier or a circuit board has a matrix of programmable connection pads for attaching a VHDLSI chip. Each pad is encircled by circuit elements (lines or vias) providing different power or signals and one of the lines or vias is selectively connected to the pad to program the connection. The pads have cut outs at the connection points to the vias and/or lines in order to simplify making of connections. The programming connections between the vias and/or lines and the pads are made after pre-finishing the board by depositing evaporated metal to form a bridge between each pad and a via or line selected for each pad. Then a passivation layer of polyimide is deposited on the vias and/or lines with an aperture at the center of each pads so that solder connections to attach the chip to the carrier module do not erroneously bridge to additional vias and/or lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.