Optical imaging system with a plurality of image planes

US5264694A · kind A · utility

Assignee

• Messerschmitt Bolkow Blohm GmbH · DE

Inventors

• Hermann Diehl · Grünwald, DE
• Franz Muller · Blankenloch, DE

Key dates

• Filing date: Jul 15, 1992
• Grant date: Nov 23, 1993
• Expiry date: Jul 15, 2012

Classification

• Technology area (CPC H): Electricity
• CPC primary: H04N25/00
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

In this optical imaging system the same object section is imaged by optical means on three spatially separate image planes. Surface sensors A, B, C of identical width which in turn comprise optoelectronic sensor elements arranged in the manner of a matrix are arranged in the three image planes at a distance from one another in parallel rows and are offset relative to one another from one row to the other. The three grids of surface sensors which are accordingly formed are offset relative to one another from one image plane to the other in such a way that the object section is detected without gaps by means of the surface sensors A, B and C during optical superposition. Thus, large surface area pictures with high resolution can be taken with the use of conventional surface sensors, e.g. of the CCD type. Due to the special arrangement of the surface sensors, three image planes with the corresponding optical means, e.g. three lenses or less than three lenses and additional beam splitter systems such as semipermeable mirrors or prisms, are sufficient.