Method of manufacturing a pressure seal type piezoelectric oscillator
US5265316A · kind A · utility
12Cited by
12References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 1991 |
| Grant date | Nov 30, 1993 |
| Priority date | — |
| Expiry date | Oct 17, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
The invention relates to a piezoelectric oscillator wherein a case and a stem are coated with a solder containing 90% and higher of lead, an inner lead is also coated with the solder thereby fixing a piece of piezoelectric oscillator by melting the solder. The invention further relates to a piezoelectric oscillator wherein the piezoelectric oscillator is performed casing by resin or metallic plate, and to a piezoelectric oscillating apparatus wherein IC and a piezoelectric oscillator are internally mold to achieve a molding of high efficiency without inferiority while surface mounting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.