Light source and technique for mounting light emitting diodes
US5265792A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 1992 |
| Grant date | Nov 30, 1993 |
| Priority date | — |
| Expiry date | Aug 20, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1768
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting diode has both end faces metallized and is mounted on a substrate with the light emitting junction perpendicular to the substrate. The electrically conductive ends are electrically bonded to conductive areas on the substrate by solder or conductive adhesive LED dice can be placed on the substrate by temporarily attaching the dice to a tape which has been wrapped around a knife edge. The dice tilt as the tape wraps around the edge and are picked off one at a time by a vacuum collet while temporarily supported by a movable finger, and then transferred by the vacuum collet to a substrate. A similar method may be used for placing semiconductor dice on a substrate without the tilting of dice around the edge. In another embodiment, an array of LEDs can be assembled in windows through a metallized plastic tape which is bonded to a foundation with additional metallized leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.