Patent · US Expired

Moisture-curing, hot-melt polyurethane adhesive compositions

US5266606A · kind A · utility

6Cited by

9References

23Claims

0Family size

Assignee

Bostik, Inc. · US

Inventors

Heinz G. Gilch · Bad Homburg vor der Höhe, DE
Walter Rath · Oberursel, DE
Karsten Seitz · Oberursel, DE

Key dates

Filing date	Mar 29, 1993
Grant date	Nov 30, 1993
Priority date	—
Expiry date	Mar 29, 2013

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S521/908
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A moisture-curing hot-melt polyurethane adhesive foam comprising isocyanate-terminated polyurethane prepolymers based on polyester or polyether and having a melting point of 40.degree. to 60.degree. C. or a glass transition point above room temperature, melted together, optionally with a nucleating agent and/or a surfactant, treated with an inert gas under pressure and released in ambient pressure is allowed to cure as a foam whereby a cure rate is achieved of at least ten times that of the composition when not foamed; extremely rapid cure rates are achieved and thick bond lines are readily obtained.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.