Imide epoxy resin composition for sealing semiconductor elements
US5266612A · kind A · utility
24Cited by
1References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 6, 1993 |
| Grant date | Nov 30, 1993 |
| Priority date | — |
| Expiry date | Jan 6, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L79/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition for sealing semiconductor elements comprising o-cresol-novolak type epoxy resins, curing agents, curing accelerators, inorganic fillers, plasticizers and imide-epoxy resins having the formula (I) is disclosed. Use of the imide-epoxy resin in an amount of 0.1 to 20.0% by weight improves the heat and moisture resistant properties of the epoxy resin composition. ##STR1## wherein, R.sub.1 and R.sub.2 denote independently H or (CH.sub.2)nCH.sub.3 radical, PA1 n denotes 0 or an integer of 1 above.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.