Molding materials based on homo- and copolyamides with olefinic double bonds

US5266656A · kind A · utility

Assignee

• BASF SE

Inventors

• Walter Goetz · Ludwigshafen, DE
• Brigitte Gareiss · Grünstadt, DE
• Andreas Deckers · Flomborn, DE
• Petra Baierweck · Schifferstadt, DE

Key dates

• Filing date: Mar 3, 1993
• Grant date: Nov 30, 1993
• Expiry date: Mar 3, 2013

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08G69/36
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Molding materials are composed of PA1 A) from 40 to 100% by weight, based on the total weight of the molding material, of a polyamide mixture based on PA2 a.sub.1) from 5 to 30% by weight, based on the total weight of the polyamide mixture, of at least one homo- or copolyamide that contains olefinic double bonds and comprises PA3 .alpha.) from 40 to 100 mol %, based on homo- or copolyamide, of at least one monomer that contains at least one olefinic double bond (monomers .alpha.) from the group of the PA4 .alpha..sub.1) olefinically unsaturated lactams, PA4 .alpha..sub.2) olefinically unsaturated aminocarboxylic acids, PA4 .alpha..sub.3) olefinically unsaturated dicarboxylic acids, PA4 .alpha..sub.4) olefinically unsaturated diamines, and PA3 .beta.) from 0 to 60 mol %, based on homo- or copolyamide, of at least one monomer that contains no olefinic double bonds (monomers .beta.) from the group of the PA4 .beta..sub.1) lactams PA4 .beta..sub.2) aminocarboxylic acids, PA4 .beta..sub.3) dicarboxylic acids, PA4 .beta..sub.4) diamines, and PA2 a.sub.2) from 70 to 95% by weight based, on the total weight of the polyamide mixture, of at least one polyamide that contains no olefinic doubl…