Vertical-cavity surface emitting laser optical interconnect technology
US5266794A · kind A · utility
75Cited by
6References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 21, 1992 |
| Grant date | Nov 30, 1993 |
| Priority date | — |
| Expiry date | Jan 21, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/18341
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A three-dimensional optical interconnection is disclosed having a stack of vertically aligned optoelectronic integrated (OEIC) modules. Each OEIC module includes an array of vertical cavity surface emitting lasers (VCSEL), receivers and electronic logic which are monolithically integrated on a single semiconductor substrate. Communication between the OEIC modules is effectuated by the free space propagation of laser radiation from the VCSELs to corresponding receivers on an adjacent OEIC module. Transistors, such as heterojunction bipolar transistors, may be used to drive the VCSELS.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.