Semiconductor device and an electronic device with the semiconductor devices mounted thereon
US5266834A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jul 21, 1992 |
| Grant date | Nov 30, 1993 |
| Priority date | — |
| Expiry date | Jul 21, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package is provided for achieving higher packing density and higher circuit integration of memories, in particular, a structure is provided having a plurality of thin, surface mount packages which are stacked up. Each of the laminated packages includes a semiconductor pellet, leads fixed to the front surface of the pellet, a radiating plate fixed to the rear surface of the same, and a resin mold member. To achieve a stabilized laminated structure, the mold member is shaped into a convex form on the front side of the pellet and into a concave form on the rear side of the same, so that the concave portion of one package can engage with the convex portion of another package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.