Single phase porous layer heat exchanger
US5267611A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 8, 1993 |
| Grant date | Dec 7, 1993 |
| Priority date | — |
| Expiry date | Jan 8, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/907
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The invention is a cooling structure for a high power density surface. Liquid is pumped along interconnected and continuous multiple channels on the backside of a sintered metal wick bonded to the cooled surface. The channels are located within a liquid delivery layer which also includes multiple liquid outlet holes, so that each outlet hole is surrounded by interconnected channels. The outlet holes are connected to a manifold to collect the pumped liquid. The input channels which surround each outlet hole are fed from manifolds at the edges of the panels, and the proximity of input channels to the outlet holes assures that liquid flow resistance within the sintered metal wick is minimized by the multiple short, wide paths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.