Process for phosphating metal surfaces
US5268041A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 1992 |
| Grant date | Dec 7, 1993 |
| Priority date | — |
| Expiry date | Sep 22, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C22/368
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a process of phosphating metal surfaces phosphating solutions are employed which are substantially free of nickel and contain ______________________________________ 0.3 to 1.7 g/l Zn 0.2 to 4.0 g/l Mn 0.001 to 0.030 (preferably 0.003 to 0.020) g/l Cu 5 to 30 g/l phosphate (calculated as P.sub.2 O.sub.5) ______________________________________ in which by oxygen and/or other equivalent oxidizers the concentration of Fe(II) is kept below 0.1 g/1 and which are adjusted to a pH value from 3.0 to 3.8. The weight ratio of Cu to P.sub.2 O.sub.5 is preferably adjusted to I: (170 to 30,000) and Cu and P.sub.2 O.sub.5 are preferably replenished in a weight ratio of 1 : (5 to 2000). The phosphating solutions should contain 0.3 to 1.0 g/1 Zn if they are applied by spraying and should contain 0.9 to 1.7 g/1 Zn if they are applied by spraying/dipping operations or by a dipping operation. The process serves particularly for the pretreatment of metal surfaces for a succeeding painting, particularly by electro-dipcoating, and for the phosphating of steel, galvanized steel, zinc alloy-plated steel, aluminum and its alloys.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.