Polyamide resin composition and film therefrom
US5268219A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 4, 1991 |
| Grant date | Dec 7, 1993 |
| Priority date | — |
| Expiry date | Sep 4, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31739
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A polyamide resin composition obtained by melting and kneading PA0 (A) a first polyamide containing not less than 90 mol %, based on the total recurring units, of a m-xylylene adipamide unit of the formula, ##STR1## and (B) a second polyamide showing a semicrystallization time of not more than 30 seconds in a constant-temperature crystallization at 160.degree. C. and having a solubility parameter in the range of 13.+-.1.5; PA0 (C) under the conditions where the following relationship is satisfied, EQU (0.025C-2.2).ltoreq.log R.ltoreq.(0.025C-0.5) PA1 wherein C is a proportion (wt. %) of the first polyamide based on the total weight of the first and second polyamides, and R is a ratio of the melt viscosity of the first polyamide to the melt viscosity of the second polyamide at a temperature higher by 20.degree. C. than the melting point of that one of the first and second polyamides which has a higher melting point than the other, provided that C is in the range of 20 to 95 (wt. %); and a film produced therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.