Heat resistant modified bismaleimide adhesive composition
US5268432A · kind A · utility
5Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1992 |
| Grant date | Dec 7, 1993 |
| Priority date | — |
| Expiry date | Jun 16, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J179/085
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A heat resistant adhesive composition comprising an admixture of a modified bismaleimide (BMI) resin, a modified polyamide-imide and a solvent. The bismaleimide is modified by barbituric acid and/or the derivatives thereof and the polyamide-imide is modified by an epoxy resin. The overall solid content of the heat resistant adhesive composition is in the range of about 15 to 50 percent by weight, wherein solid contents per overall solid content of the modified bismaleimide resin and the modified polyamide-imide are 60 to 90 percent and 10 to 40 percent, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.