Pre-stressed laminated lid for electronic circuit package
US5268533A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 1991 |
| Grant date | Dec 7, 1993 |
| Priority date | — |
| Expiry date | May 3, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lid (2) for an electronic circuit housing (4) has inner (24) and outer (22) laminated layers that are formed from two different materials, joined to each other and bowed outward from the housing (4) so that the inner layer (24) is under tensile bending stress at the interface between the layers, and the outer layer (22) is under compressive bending stress at the interface. This forms a pre-stress on the lid that resists external loads, and causes the lid to deflect under loading in a linear, predictable and recoverable fashion. The lid is preferably formed by thermal bonding of two materials having different coefficients of thermal expansion, with the bow forming as the materials cool. In one example two different metals are used, and in another a metal is bonded to a glass-ceramic tape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.