Apparatus and method for coating a substrate using vacuum arc evaporation
US5269898A · kind A · utility
25Cited by
5References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 17, 1991 |
| Grant date | Dec 14, 1993 |
| Priority date | — |
| Expiry date | Dec 17, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/325
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus and method are described for depositing a coating onto a substrate using vacuum arc evaporation from a substantially cylindrical cathode. An axial magnetic field is disclosed to force the motion of the arc into an open helical trajectory on the cathode surface. Means are also provided for controlling the speed and direction of the arc along the cathode by varying the division of input current between the ends of the cathode. Improved uniformity of cathode erosion and coating thickness are thereby achieved, along with a reduction in the number and size of splattered droplets incorporated into the coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.