Cathode assembly for cathodic sputtering apparatus
US5269899A · kind A · utility
30Cited by
25References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 29, 1992 |
| Grant date | Dec 14, 1993 |
| Priority date | — |
| Expiry date | Apr 29, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3423
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Elastic and plastic deformation of backing plate members in target-backing plate cathode assemblies for cathodic sputter coating apparatus are minimized by the provision of a concave surface portion located at the target/backing plate interface and by provision of a backing plate material having a yield strength of at least about 35 ksi.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.