Nonwoven bonding technique
US5269994A · kind A · utility
8Cited by
12References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 10, 1992 |
| Grant date | Dec 14, 1993 |
| Priority date | — |
| Expiry date | Apr 10, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1084
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Thermally bonding nonwoven fabrics having superior tensile stength without decreased absorbency are prepared by supplying a web to a hot calender bonding system and passing the resulting calendered web to a hot-air bonding system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.