Thermal mimeograph paper
US5270099A · kind A · utility
32Cited by
0References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 1991 |
| Grant date | Dec 14, 1993 |
| Priority date | — |
| Expiry date | Oct 2, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31993
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The present invention provides a thermal mimeograph paper having a point-bonded structure and including a porous backing material and a thermoplastic resin film layer laminated on one side thereof through an adhesive, wherein the porous backing material and the thermoplastic resin film are bonded together by dotwise point bonding. This point-bonded structure enables the perforability of the mimeograph paper to be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.