Patent · US Expired

Thickened curable molding compound of unsaturated polyester resins

US5270357A · kind A · utility

6Cited by

5References

7Claims

0Family size

Assignee

BASF SE

Inventors

Anton Hesse · Weinheim, DE
Dieter Buhl · Bischofswerda, DE
Birgit Potthoff-Karl · Weinheim, DE
Axel Sanner · Bischofswerda, DE

Key dates

Filing date	Jan 24, 1992
Grant date	Dec 14, 1993
Priority date	—
Expiry date	Jan 24, 2012

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L67/06
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A curable thickened polyester resin molding compound contains from 0.1 to 20 parts by weight of a thermoplastic vinyl polymer which is compatible with the resin and contains acid groups.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.