Adhesive compositions for electronic packages
US5270371A · kind A · utility
7Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 1992 |
| Grant date | Dec 14, 1993 |
| Priority date | — |
| Expiry date | Oct 2, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Chip adhesives with improved working time comprise a polyetherimide prepared from 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride and bis(4-aminophenyl) sulfone; at least one of silica and conductive metal particles, especially silver particles; and at least one substituted acetophenone as solvent. The preferred substituted acetophenone is 4-methylacetophenone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.