Outer bonding tool for tape carrier and method of producing semiconductor device
US5271147A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 9, 1992 |
| Grant date | Dec 21, 1993 |
| Priority date | — |
| Expiry date | Jun 9, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An outer bonding tool is used for bonding outer leads of a tape carrier on corresponding pads which are formed on a circuit substrate by solder after bonding inner leads of the tape carrier and electrodes of a generally rectangular semiconductor chip. The outer bonding tool includes a main body having a bottom surface, a pressing surface provided at the bottom surface of the main body for pressing against the outer leads of the tape carrier, where the pressing surface has a generally rectangular frame shape, and a groove formed in the pressing surface and extending generally perpendicularly to a corresponding group of outer leads extending from one side of the semiconductor chip. A width of the groove taken in a direction in which the corresponding group of outer leads extend is smaller than a length of the outer leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.