Duct tape having a non-depositing adhesive
US5271999A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 16, 1992 |
| Grant date | Dec 21, 1993 |
| Priority date | — |
| Expiry date | Nov 16, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2754
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A duct tape having a non-depositing pressure sensitive adhesive, wherein said duct tape can be removed after application to a surface of a substrate, the duration of the application being indefinitely extended for multiple weeks, without leaving an adhesive residue on the surface of the substrate, where the non-depositing adhesive is a hot melt adhesive based on a SIS Styrenic Block Copolymer rubber having around 40% diblock, that is tackified with an aromatic C-5 resin, and wherein said adhesive has an excellent antioxidant system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.