Laminate material and its use as heat-sink
US5272009A · kind A · utility
4Cited by
12References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 1992 |
| Grant date | Dec 21, 1993 |
| Priority date | — |
| Expiry date | Mar 27, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The laminate material comprises a sintered silicon carbide substrate (S) on which there is deposited by CVD a diamond layer in an enclosure (1) fed with 1% methane in hydrogen through a conduit (13), this gas mixture being activated by a hot tantalum filament raised to 2000.degree. C. This layer is thereafter covered, in another enclosure, with an AlN layer formed from a mixture of H.sub.2 +2% AlCl.sub.3 reacting with a mixture of H.sub.2 +1% NH.sub.3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.