Production method for an IC card and its IC card
US5272374A · kind A · utility
74Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 1991 |
| Grant date | Dec 21, 1993 |
| Priority date | — |
| Expiry date | Jul 9, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An IC card comprises a card board having first and second major surfaces and a semiconductor module having an electrode terminal face. The semiconductor module is mounted in the card board, so that the electrode terminal face is exposed onto the first major surface of the card board. The card board comprises a board frame and a resin which is molded inside the board frame. Part of the semiconductor module surface which is opposite to the electrode terminal face, is covered with the resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.