Patent · US Expired

Housing for an electronic circuit with improved heat dissipation means

US5272593A · kind A · utility

22Cited by

4References

5Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Gert Jakob · Stuttgart, DE
Karl Schupp · Pforzheim, DE
Dieter Hussmann · Steinheim, DE
Thomas Jessberger · Asperg, DE
Dieter Karr · Tiefenbronn, DE

Key dates

Filing date	Oct 8, 1992
Grant date	Dec 21, 1993
Priority date	—
Expiry date	Oct 8, 2012

Classification

Technology area (CPC H)Electricity
CPC primaryH05K7/20854
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The housing for an electronic circuit is box-shaped, and on each of its longitudinal sides in its interior has a shoulder (44, 45), and above each of those a ridge (47, 48) and -- extending along a longitudinal side. A cooling frame (11) is pushed into the grooves (52, 53) formed between shoulder and ridge, with a printed circuit board (10) being fixed to the underside of the cooling frame. In its interior, the cooling frame has cooling tabs (15, 16, 17) which stand perpendicular to the surface of the printed circuit board and on which power components (20) are fixed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.