Stress-free mounting and protection of liquid-cooled solid-state laser media
US5272710A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 1992 |
| Grant date | Dec 21, 1993 |
| Priority date | — |
| Expiry date | Sep 8, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/1653
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laser structure that reduces thermally-induced mounting stress on low fracture strength solid-state laser rods. A transparent sleeve of relatively high strength optical material that has relatively high thermal conductivity is provided around the laser rod, and a thin layer of elastomer is provided between the laser material and the transparent sleeve. This arrangement of laser material, transparent sleeve, and elastomer allows sealing of a cooling fluid flow channel disposed around the laser/sleeve assembly using conventional means without applying stress directly to the laser rod material. This reduces the risk of fracturing the laser rod material due to thermal expansion near the seal and allows the laser to be operated at higher average power levels. The elastomer layer and high thermal conductivity sleeve efficiently conduct heat from the laser rod to the surrounding cooling liquid. This structure also minimizes damage to the surface of the strengthened laser rods due to handling and coolant erosion thereby preserving the thermal stress fracture resistance properties of the laser rod during transport, manufacturing assembly, operation, and maintenance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.