Lead conditioning apparatus and method for semiconductor devices
US5273081A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 11, 1991 |
| Grant date | Dec 28, 1993 |
| Priority date | — |
| Expiry date | Dec 11, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0092
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for conditioning the leads of a semiconductor device having parallel leads projecting in a predetermined configuration. The apparatus includes a device for engaging and massaging the leads to reintroduce a predetermined spacing between the leads, bringing the leads into parallelism. The apparatus further includes a device for forming the leads to at least partially remove any bends in the leads, and a device for reforming the leads to a predetermined configuration. The lead conditioning method includes the steps of bringing the leads into parallelism, forming the leads to a partially unbent condition, and shaping the leads in a desired lead configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.