Wafer suspension box
US5273159A · kind A · utility
47Cited by
14References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 26, 1992 |
| Grant date | Dec 28, 1993 |
| Priority date | — |
| Expiry date | May 26, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67369
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ridged, transparent, thermoplastic package for transporting substrate wafers is disclosed. The package includes elastomeric cushions which hold the substrate wafers in a manner which precludes them from becoming damaged during normal shipping and handling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.