Thermally conductive elastomeric interposer connection system
US5273439A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 1993 |
| Grant date | Dec 28, 1993 |
| Priority date | — |
| Expiry date | Mar 11, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/66
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multi-chip module electrical and thermal conducting apparatus is provided. The apparatus is disposed between layers or boards of the module and includes electrical conducting traces. Electrical conductors are deposited on the faces of the layers and the traces electrically interconnect the electrical conductors of the two layers. The traces are joined to an elastomeric body and insulating material that are essentially non-conductive of electrical and thermal energy. The apparatus includes a thermal conduction unit that acts as a thermal shunt around the body and insulating material. The thermal conduction unit is electrically isolated from the traces. Thermal energy is received by the thermal conduction unit when heat is generated by the activation of electronic components mounted on the module layers. The thermal energy received by the thermal conduction unit is carried away by thermal vias formed in the module layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.