Apparatus and method for handling fragile semiconductor wafers
US5273615A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 1992 |
| Grant date | Dec 28, 1993 |
| Priority date | — |
| Expiry date | Apr 6, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/11
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus (60) which handles fragile semiconductor wafers (21) adhesively mounted to a submount (22) using a high temperature wax is provided. The apparatus (60) includes a vacuum chuck (24) for holding a first surface of the wafer (21) and a solvent chamber (11, 11') for applying solvent to the back surface of the submount (22). The apparatus (60) includes an enclosure (29) for providing an inert gas environment around the solvent chamber (11, 11'), the wafer (21), and the vacuum chuck (24). The apparatus (60) further includes a means for remounting (30) the wafer (21) to a submount (22) using a low temperature wax after the high temperature wax is dissolved. The wafer (21) is then released from the vacuum chuck (24) and the first surface of the wafer (21) is mounted to an adhesive tape (34). Following the mounting, the low temperature wax is dissolved or melted to demount the wafer (21 ) from the submount (22), leaving the wafer (21) securely mounted on the adhesive tape (34) for sawing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.