Foamable epoxy resin composition
US5274006A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 1992 |
| Grant date | Dec 28, 1993 |
| Priority date | — |
| Expiry date | Feb 18, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2363/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention provides a foamable epoxy resin composition (A) 100 parts by weight of a liquid epoxy resin (B) 0.5-20 parts by weight of a latent curing agent, (C) 0.5-15 parts by weight of a foaming agent having a decomposition temperature of 100.degree.-220.degree. C., (D) 0.05-5 parts by weight of a surface active agent and (E) 10-200 parts by weight of a rubbery elastomer or a powdery halogen-free thermoplastic resin of 150 .mu.m or less in average particle diameter, which composition has a melt viscosity of 2.5.times.10.sup.3 -5.times.10.sup.4 dPa.multidot.s at the decomposition temperature of said foaming agent. The composition can provide a foamed material of rigidity and good heat resistance, having an expansion ratio of 5 times or more and a dense cell structure of 0.5 mm or less in average cell diameter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.