Integrated circuit having metal substrate
US5274570A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 1993 |
| Grant date | Dec 28, 1993 |
| Priority date | — |
| Expiry date | Apr 16, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/361
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit of this application includes a circuit board in which a conductive layer of a desired pattern is formed on a metal substrate through an insulating layer, a circuit element mounted on the insulating layer, and first and second connectors for connecting at least the circuit element and an external device. The circuit element is nondetachably mounted on the insulating layer, and has a nonvolatile content which can be rewritten by an external operation. The first connector connects at least the circuit element to a portion to be controlled, and the second connector connects the circuit element and an external processing device via a path different from that of the first connector so as to process a storage content of the circuit element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.