Method of making connector with monolithic multi-contact array
US5274917A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 1992 |
| Grant date | Jan 4, 1994 |
| Priority date | — |
| Expiry date | Jun 8, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49179
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Connectors for attachment to cables including a large number of very small flexible conductors or conductor pairs, in which very small contacts are provided as an array exposed on a flat mating surface. Contacts may be raised slightly above the flat surface by plating conductive metal to form raised bumps on one of a pair of connectors. Individual conductors are placed through apertures defined in a substrate acting as a template, and are potted in place before shaping the mating surface of the connector. Contact bases to be plated may be defined precisely by photoresist lithography on a cover layer attached to the template substrate, and an elastomeric layer may be provided between the cover layer and the template substrate. Pin and socket combinations are used to align mating connectors with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.