Dual manifold heat pipe evaporator

US5275232A · kind A · utility

Assignee

• Sandia National Laboratory · US

Inventors

• Douglas R. Adkins · Albuquerque, US
• K. Scott Rawlinson · Albuquerque, US

Key dates

• Filing date: Mar 15, 1993
• Grant date: Jan 4, 1994
• Expiry date: Mar 15, 2013

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S159/906
• WIPO field: Thermal processes and apparatus
• WIPO sector: Mechanical engineering

Abstract

An improved evaporator section for a dual manifold heat pipe. Both the upper and lower manifolds can have surfaces exposed to the heat source which evaporate the working fluid. The tubes in the tube bank between the manifolds have openings in their lower extensions into the lower manifold to provide for the transport of evaporated working fluid from the lower manifold into the tubes and from there on into the upper manifold and on to the condenser portion of the heat pipe. A wick structure lining the inner walls of the evaporator tubes extends into both the upper and lower manifolds. At least some of the tubes also have overflow tubes contained within them to carry condensed working fluid from the upper manifold to pass to the lower without spilling down the inside walls of the tubes.