Method of forming bonding bumps by punching a metal ribbon
US5275970A · kind A · utility
16Cited by
5References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 1991 |
| Grant date | Jan 4, 1994 |
| Priority date | — |
| Expiry date | Oct 17, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49153
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method of forming bonding metal bumps on electrodes of a submount for use with an optical device array. Small bonding metal pieces are arranged on a transfer piece resting substrate so as to be aligned with the electrodes of the submount. Next, the bonding metal pieces thus arranged are transferred onto respective electrodes of the submount. In one embodiment, bonding metal pieces are preferably formed by punching a ribbon-shaped bonding metal and respectively fixed by a force of the punching operation directly onto the electrodes of the submount.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.