Thermosetting resin composition comprising maleimide, anhydride, epoxy resin and wollastonite
US5276073A · kind A · utility
5Cited by
5References
10Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 6, 1992 |
| Grant date | Jan 4, 1994 |
| Priority date | — |
| Expiry date | Aug 6, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B3/40
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thermosetting resin composition useful for slot insulation purposes is disclosed, which includes: PA0 a liquid epoxy resin; PA0 a curing agent including an acid anhydride; PA0 a maleimide resin in an amount of 3-50 parts by weight per 100 parts by weight of the liquid epoxy resin; and PA0 finely divided wollastonite in an amount of 50-400 parts by weight per 100 parts by weight of the liquid epoxy resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.