Heat sink mounting apparatus
US5276585A · kind A · utility
69Cited by
3References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 16, 1992 |
| Grant date | Jan 4, 1994 |
| Priority date | — |
| Expiry date | Nov 16, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A clip having parallel edge frames with pockets at each end and connected by transverse beams is used to removeably secure a heat sink to an orthogonal device package by inserting the corners of the device package in the pockets to secure the heat sink between the transverse beams and the surface of the device package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.