Patent · US Expired

Method for coating components or shapes by cathode sputtering

US5277778A · kind A · utility

13Cited by

12References

9Claims

0Family size

Assignee

Leybold GmBH · DE

Inventors

Christoph Daube · Alzenau, DE
Uwe Kopacz · Großkrotzenburg, DE
Siegfried Schulz · Rolling Meadows, US

Key dates

Filing date	Sep 5, 1991
Grant date	Jan 11, 1994
Priority date	—
Expiry date	Sep 5, 2011

Classification

Technology area (CPC H)Electricity
CPC primaryH01J37/3405
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

Coating of components and shapes by cathode sputtering of target material of a first cathode system (6) with concentration of a first discharge space (plasma cloud) in the vicinity of the target surface by a spatially closed magnetic field (plasma trap) opposite the target (12). The field strength is reduced in front of the target surface by an additional magnet associated with a lateral boundary of the target.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.