Resin systems of improved toughness and high temperature performance and method therefor
US5278224A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 1991 |
| Grant date | Jan 11, 1994 |
| Priority date | — |
| Expiry date | Aug 13, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/928
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This disclosure addresses resin systems which contain thermosetting materials and thermoplastic modifiers, the resin systems being formed by dispersing particles of thermoplastic solids in the thermosetting materials, the particles being soluble in the resins at temperatures below the resin system gelation temperature. According to this disclosure, the systems are improved by the use of a blend of two types of thermoplastic material--a high glass transition temperature thermoplastic such as a poly(benzophenone-imide) and a high toughness thermoplastic such as a poly(ether-imide). By appropriate adjustment of the relative amounts of these two thermoplastics, resin system properties such as toughness, service temperature, thermal stability and solvent resistance can be adjusted to optimum levels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.