Semiconductor device assembly carrier
US5278447A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 16, 1992 |
| Grant date | Jan 11, 1994 |
| Priority date | — |
| Expiry date | Jan 16, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Damage to the package body and external leads of a leaded semiconductor device assembly is prevented by a carrier assembly. The carrier assembly includes a rigid bottom (lower) plate positively supporting the package body and providing a bottom cover for the external leads. A semi-rigid top (upper) plate positively holds the package body against the bottom plate, prevents movement of the package body with respect to the carrier assembly, and covers the external leads. Fasteners are provided for securing the upper plate to the lower plate, preferably at the four corners of the plates. In this manner, a durable "sandwich" structure is created, with the package disposed between the lower and upper plates and the body and leads well protected against damage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.