Method for dividing substrates of liquid crystal displays using repeated measurements
US5278685A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 27, 1992 |
| Grant date | Jan 11, 1994 |
| Priority date | — |
| Expiry date | Oct 27, 2012 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/133305
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
First and second transparent hard plastic substrates are placed one over the other to form therebetween a gap into which a liquid crystal is to be sealed in. The first and second substrates are mounted on the reference plane of a stage. The distance between the first substrate and the reference plane is measured in a non-contact manner at a plurality of measuring points on a predetermined dividing line. Based on the distances measured, a slit is formed on the first substrate by cutting the first substrate along the dividing line while leaving a portion of a predetermined thickness uncut. The first substrate is then broken along the slit. With this arrangement, it is possible to cut the substrates while leaving a portion of an appropriate thickness uncut irrespective of unevenness of the thickness or waviness of the first substrate. Moreover, since the surfaces of the cut sections of the substrates do no crack and since the portions of the substrates to be broken have a reduced thickness, the divided sections have smoother surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.