Electronic package and method of making same
US5278724A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 1992 |
| Grant date | Jan 11, 1994 |
| Priority date | — |
| Expiry date | Jul 6, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10681
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package and method of making same wherein the package includes a first substrate (e.g., printed circuit board), a second, flexible circuitized substrate (e.g., polyimide dielectric with conductors thereon) having a semiconductor device (chip) electrically coupled thereto. The outer portions of the flexible circuitized substrate are wrapped about the frame which in turn includes portions thereof which serve to spacedly position the wrapped flexible substrate with respect to the first substrate such that conductors on both substrates may be precisely aligned and electrically coupled in a permanent manner. A method of assembling the invention, including the use of a vacuum head and appropriate heat thermodes, is also defined.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.